Ethylene Glycol Diacetate (EGDA), also known by its IUPAC name 1,2-diacetoxyethane (CAS No: 111-55-7), is a high-performance, oxygenated solvent characterized by its clear, colorless appearance and mild, pleasant odor. Chemically, it is the diester of ethylene glycol and acetic acid. EGDA is increasingly favored in industrial chemistry as a safer, more sustainable alternative to traditional high-boiling solvents like Isophorone, Cyclohexanone, and various glycol ethers.
Its primary appeal lies in its unique combination of a high boiling point and a slow evaporation rate, which facilitates excellent flow and leveling in coating applications. Furthermore, EGDA exhibits low toxicity, high biodegradability, and a high flash point, significantly reducing fire hazards in the workplace. Its robust solvency power allows it to dissolve a wide range of resins, including nitrocellulose, cellulose acetate, and many acrylic and vinyl systems. In specialized sectors like the foundry industry, EGDA serves as a critical hardening agent for phenolic resin binder systems, demonstrating its versatility beyond traditional solvent use.
**Superior Solvency:** Exhibits strong dissolving power for a variety of resins such as cellulose, acrylics, and polyurethanes, ensuring uniform formulations.
**Slow Evaporation Profile:** The low volatility promotes exceptional flow, leveling, and gloss in coatings, preventing surface defects like “orange peel.”
**Enhanced Safety Profile:** Features a high flash point (approx. 88°C) and low vapor pressure, minimizing inhalation risks and flammability hazards during processing.
**Environmental Compatibility:** Readily biodegradable and offers a lower toxicological profile compared to halogenated or aromatic solvents.
**Miscibility:** Partially soluble in water and highly miscible with most organic solvents, allowing for versatile formulation flexibility.
**Molecular Formula:** $C_6H_{10}O_4$ (Molecular Weight: $146.14 text{ g/mol}$).
**Boiling Point:** Typically ranges from $190^circtext{C}$ to $192^circtext{C}$ at $760 text{ mmHg}$, classifying it as a high-boiling solvent.
**Density:** Approximately $1.106 text{ g/cm}^3$ at $20^circtext{C}$, making it denser than water.
**Low Moisture Content:** Generally produced with high purity (min. 99%) and very low water content to prevent side reactions in sensitive systems.
**Refractive Index:** Approximately $1.415$ at $20^circtext{C}$, contributing to clear, high-gloss finishes in optical and coating applications.
**Vapor Pressure:** Very low at $0.25 text{ mmHg}$ at $20^circtext{C}$, facilitating long open times in industrial processes.
• Electrical and electronics
• Connectors, switches, PCB housings, terminal blocks
• Automotive
• Under-hood components, interior assemblies, cable conduits
• Wire and cable
• Insulation layers, sheathing, jacketing materials
• Construction
• Plastic fittings, conduits, insulation panels
• Consumer appliances
• Enclosures, adapters, plugs, casings
• Industrial components
• Fiber-reinforced composites, flame-retardant masterbatches
• Compatible polymers
• PA6, PA66
• PBT, PET
• PE, PP
• Blends and copolymers requiring halogen-free flame retardancy
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