Hydroxypropyl butyne Diether Disulfonate Sodium Salt

Hydroxypropyl butyne Diether Disulfonate Sodium Salt, identified by CAS number 70247-04-8, is a high-performance anionic surfactant and functional additive primarily utilized in the electrochemical industry. This chemical compound is synthesized through the reaction of 2-butyne-1,4-diol with epichlorohydrin, followed by a strategic sulfonation process to enhance its solubility and ionic character. As a specialized polyether sulfonate, it functions as a potent leveling agent and brightener in acidic copper electroplating baths. Its unique triple-bond structure derived from the butyne backbone provides exceptional stability and electron density, facilitating uniform metal deposition across complex geometries. The sodium salt form ensures high water solubility and compatibility with various electrolyte systems. In industrial electrolytic processes, this compound is indispensable for achieving high-gloss, ductile copper layers while simultaneously reducing internal stress in the deposited metal. Its chemical resilience under high current densities makes it a preferred choice for advanced electronics manufacturing and high-end decorative finishing applications worldwide.