Electro Plating, High-Purity Solvents

NN Dimethyl Dithiocarbamylpropyl Sulfonic Acid Sodium Salt

NN Dimethyl Dithiocarbamylpropyl Sulfonic Acid Sodium Salt, commonly referred to as DPS or sodium 3-(dimethylcarbamothioylthio)propane-1-sulfonate, is a specialized organosulfur compound predominantly utilized within the electroplating industry. Identified by the CAS registry number 18880-36-9, this white to slightly yellowish crystalline powder serves as a high-performance brightening agent specifically designed for acidic copper plating baths. Structurally, it integrates a dithiocarbamate group with a sulfonic acid salt, granting it unique chemical properties that influence metal deposition at the molecular level. Its primary function involves acting as a grain refiner and leveling agent, ensuring that copper layers deposited onto substrates are uniform, dense, and possess a high metallic luster. Furthermore, the sodium salt form enhances its solubility in aqueous electrolytes, making it an essential additive for achieving decorative and functional finishes in electronics and automotive sectors. Its stability under varying electrolytic conditions makes it a reliable component in precision plating processes worldwide today.

Attributes

Key Features and Benefits

Provides exceptional brightness and leveling power in acid copper baths.
Enhances the ductility and uniformity of deposited copper layers.
Functions effectively at low concentrations, reducing overall chemical consumption.
Exhibits excellent compatibility with other plating additives like polyethers and wetting agents.
Improves the throwing power of the electrolyte for complex geometries.
Ensures high-quality surface finishes resistant to oxidation and tarnish.
Facilitates rapid metal deposition rates without compromising surface integrity.
Maintains high stability across a broad range of operating temperatures and current densities.
Lowers the risk of pitting or burning in high-current density areas.
Supports sustainable production methods and enhanced process efficiency.

Specifications

Technical Highlights

Chemical Formula: C6H12NNaO3S3.
Molecular Weight: 265.35 g/mol.
Physical State: Fine white to off-white crystalline powder.
Assay Purity: Greater than 98 percent pure.
Solubility: Excellent in water and acidic electrolytic media.
Decomposition Temperature: High thermal stability under standard industrial usage.
Synergistic Mechanism: Operates effectively alongside SPS and various wetting agents.
Performance: Acts as a grain refiner during electrodeposition.
Concentration: Typically used in ranges of 10 to 50 milligrams per liter.
Storage: Requires moisture-proof packaging and cool environments.
Safety: Non-flammable but requires standard chemical handling protocols for laboratory personnel protection.
Density: Consistent bulk density profiles.
Hygroscopicity: Minimal uptake under dry controlled storage.

Download Technical Data Sheet (TDS)

Practical industry uses

Applications

Primary additive for acidic copper electroplating in the printed circuit board (PCB) industry.
Essential for through-hole plating and micro-via filling in advanced electronics.
Used in the automotive industry for decorative chrome plating base layers.
Applied in the manufacturing of rotogravure printing cylinders for high-precision imaging.
Utilized in sanitary hardware production for high-gloss metallic finishes.
Employed in jewelry manufacturing for consistent underplating.
Used in functional plating for electrical connectors and terminals.
Integral to high-speed plating processes in continuous wire and strip production.
Suitable for electroforming applications requiring high tensile strength and smoothness.
Component in specialty metal finishing and acidic electrolytic baths.