Aluminium Diethylphosphinat (ADP), Flame Retardants

VP-9003 Halogen Free Organic Phosphorus Flame Retardant

VP-9003 is a halogen free organic phosphorus flame retardant based on an organophosphinate structure. It offers high thermal stability, strong hydrolysis resistance, and excellent dispersion. Its ultrafine particle size supports uniform distribution in epoxy resins, phenolic resins, polyesters, adhesives, and engineered polymer systems. With a phosphorus content of around 23 percent and a decomposition temperature above 350 °C, VP-9003 provides reliable flame retardancy for demanding electrical, adhesive, and composite applications.

Attributes

Key Features and Benefits

Halogen free formulation meets RoHS, REACH, and WEEE requirements for safer polymer systems.
High phosphorus content of ≥23 percent delivers strong flame-retardant performance at lower loadings.
Ultrafine particle size (D95 < 10 μm, D50 1.5–4 μm) ensures uniform dispersion in high-performance resins.
Decomposition temperature of ≥350 °C supports high-temperature processing and soldering environments.
Provides strong hydrolysis resistance for humid and demanding operating conditions.
Low smoke generation and non-corrosive behaviour suit electronic and clean-room applications.
Chemically inert and insoluble in water and common organic solvents.

Specifications

Technical Highlights

Appearance: White granular powder.
Phosphorus content: ≥23 wt percent.
Moisture content: ≤0.8 wt percent.
Average particle size (D50): 1.5–4.0 μm.
Particle size (D95): <10 μm.
1 percent weight loss temperature (TGA): ≥350 °C.
5 percent weight loss temperature (TGA): ≈400 °C.
Water solubility (25 °C): 1.6 g/L.
pH (10 g/L @ 25 °C): 4–5.
Bulk density: 0.5–0.8 g/cm³.
Recommended loading: 8–18 wt percent depending on polymer.

Download Technical Data Sheet (TDS)

Practical industry uses

Applications

Electronics and electrical components including FCCL, PCB substrates, potting compounds, and encapsulants.
Adhesives and sealants such as halogen free hot-melt adhesives, epoxy adhesives, and structural bonding films.
Flexible films and coatings including FFC insulation films, hot-melt sealing films, and heat-pressing films.
Composites including high-temperature laminates, resin-coated copper (RCC), and engineered polymer sheets.
Wire and cable applications for halogen free flame-retardant extrusion and micro-electronic insulation.
Applicable polymers: Epoxy (EP), Phenolic (PF), PET, PBT, PA6, PA66, PU, PP, PE, and thermoplastic adhesives.